Failure Analysis Engineer

Failure Analysis Engineer | Base location in India and who can travel/work in Taiwan. Job Description: Perform the full range of activities in Failure Analysis for customer-returned failure ICs; Discuss and fully comprehend the customer failure mode, type and rate from CQE/FAE using the CRA form, and ensure customer failure mode has been verified on the bench by the FAE; Carry out non-destructive analysis such as external package inspection using optical microscopy, continuity checks using digital multimeters or IV curve tracing, X-ray inspection, CSAM, and others where necessary; Rework failure units through cleaning and re-balling for WLCSPs; Perform electrical retest of the failure units on the ATE; Work with Engineering to understand the parametric or functional failure items from the ATE retest; Carry out further non-destructive verification of the failure mode if necessary, including bench test using EVBs; Prepare and submit interim 4D/FAR and 8D/CAR to Sales/FAE as an update of the progress for the FA; Develop the Destructive FA plan that includes Decapsulation, Delayering, High-power OM and SEM, FIB, Cross-sectioning and other analysis techniques by coordinating such work with 3rd party labs. Generate, communicate and submit final 4D/FAR and 8D/CAR to Sales/FAE in a timely manner; Work closely with SQE on assembly-related quality issues and PE/DE on design-related failures; Manage customer complaints by working closely with CQE/SQE and subcontractors on the required action items; Submit and present FA updates during weekly TQM review meeting; Perform any other tasks that are assigned by the Supervisor as and when required; and Be an active TQM member by contributing knowledge and value to the team. Position Requirements: 1-5 years of work experience in analog/power IC companies Knowledge of Failure Analysis and FA techniques, including EFA, NDA, DFA and Fault Isolation Good Understanding of semiconductor device physics and IC packaging technologies will be favorable Basic knowledge of Foundry and OSAT processes, especially WLCSP and FC packaging, is highly desirable Good communication, interpersonal and team skills Interested? Send your updated profile to [email protected] Know someone who would be a great fit? Please like, comment, and share this post within your network to help us reach the right talent.