Design Engineer - Hardware Packaging

Design and development of electronic and electro-mechanical systems like
\n dashboard, controller module, converter modules, charger, sensors, actuators for
\n various applications.
\n ? Testing and Validation of systems designed and interactions between them by
\n understanding the vehicle architecture.
\n ? Design and Development of enclosures in plastic, sheet metal, casting, etc for
\n various electrical and electronic assemblies that are part of the vehicle and charging
\n infrastructure.
\n ? Responsible for ensuring manufacturability of electronic box build assembly
\n components and drive quality controls.
\n ? Make significant contributions to review of Tools, Jigs, Fixtures and End of Line test
\n equipment at supplier locations.
\n ? Responsible for Electromechanical Interaction and Impact Analysis and experience
\n in Tolerance stack-up.
\n ? Regression testing including Thermals, Sealing, Vibration, Shock, and structural
\n tests across 3D Printed prototypes and off the tool and process samples and DVT of
\n electronic packaging enclosures and electrical harness.
\n ? Maximize reuse of platforms and design resources to help reduce TTM, cost, and to
\n enhance quality; implement lessons learnt into designs.
\n ? Participate in and contribute to DFMEA, DFM, DFA, DFC, DFS, DFR, and component
\n selection/derating reviews carry out RCA on field failures and
\n implement/recommend CAPA.
\n ? Participate in regulatory tests such as UL, ARAI, BIS, IEC standards for
\n electrical/electronic assemblies.
\n ? Performing Problem solving using industry best practices such as 5-Why analysis,
\n Fishbone diagram, RCA methodologies etc..
\n ? Project execution following PMP, Agile methodologies
\n HERE S WHAT WE ARE LOOKING FOR:
\n ? Experience in designing plastics and sheet-metal for electro-mechanical enclosures
\n with attention to electromechanical interactions.
\n ? Experience in material selection, manufacturing process for Plastics, sheet metal
\n and casting.
\n ? Advanced knowledge in fasteners, inserts, surface treatment methodologies, and
\n engineering plastics used for electronic packaging.
\n ? Knowledge of Geometric Dimensioning & Tolerancing, generation of First Article
\n Report (FAR)
\n ? Knowledge of DFMEA, PFMEA, AFMEA DFM, DFA, DFC, DFR, DFS, Poka-Yoke
\n methods and techniques, sealing and venting mechanisms
\n ? Experience of working in at least one complete product development life
\n cycle.
\n ? Knowledge on APQP, PFMEA, and basics of tool design will be an added
\n advantage .
\n ? Exposure to PPAP and Supplier quality audits .
\n ? Understanding of electronics components will be an added advantage.
\n ? Exposure to PCBA interaction and packaging of the same in an enclosure
\n considering the power dissipation, EMI/EMC requirements
\n ? Knowledge on Thermal design including interface materials and simulation
\n will be an added advantage
\n ? Experience with working on SW tools such as Siemens NX, PLM Tools (
\n Teamcenter, JIRA etc..), FMEA tools, Pugh Matrix and Basic understanding of
\n CAE tools such as Ansys/Fluent.
\n ? A good team player with interpersonal planning and go